Analysis of Ceramic PCB Manufacturing: A Comprehensive Comparison of Materials, Processes, and Multilayer Technologies

Ceramic PCBs have become an indispensable choice for high-power and high-frequency applications. Thanks to their exceptional thermal performance and high reliability, they are widely used in areas such as 5G technology, automotive electronics and medical devices. However, choosing the right ceramic PCB is no simple task.

In this article, I will guide you through comparing the performance, manufacturing complexity and multilayer capabilities of various ceramic PCB materials. I will also help you to select the right ceramic PCB manufacturer. My goal is to empower you to make more informed decisions and ensure your projects run more smoothly.

Performance Comparison of Different Ceramic PCB Materials

1.Thermal Conductivity

Thermal conductivity is one of the key factors affecting ceramic PCB performance, directly impacting the material’s heat dissipation capability and maximum sustainable power density.

Beryllium Oxide (BeO): With thermal conductivity reaching 250–300 W/m·K, it offers the highest thermal performance among all ceramic materials. However, its toxicity requires special attention, limiting its application scope.

Aluminum Nitride (AlN): With a thermal conductivity ranging from 170–230 W/m·K, it offers excellent heat dissipation without toxicity concerns, making it suitable for most high-power applications.

Silicon Carbide (SiC): Thermal conductivity ranges from 120–200 W/m·K. While highly thermally conductive, its inherent electrical conductivity necessitates additional insulation layers.

Silicon Nitride (Si₃N₄): Thermal conductivity of 70–90 W/m·K. Though lower than AlN and SiC, it offers exceptional mechanical strength, making it suitable for reliability-critical applications.

Aluminum Oxide (Al₂O₃): Thermal conductivity of 20–30 W/m·K. Suitable for medium-power applications, it is widely used as an economical solution.

2.Power Density

For applications with high power density (e.g., exceeding 15 W/cm²), materials with high thermal conductivity such as aluminum nitride or beryllium oxide must be selected to ensure effective heat dissipation.

For power densities within the 5-15 W/cm² range, silicon nitride is a suitable choice due to its excellent thermal properties and outstanding mechanical reliability.

For applications below 5 W/cm², aluminum oxide is typically sufficient.

3.Coefficient of Thermal Expansion (CTE) Matching

Matching the CTE with silicon devices impacts long-term product reliability. Compared to aluminum oxide (6.5–7.5 ppm/K) and beryllium oxide (7.5 ppm/K), aluminum nitride (4.5 ppm/K) and silicon nitride (3.2 ppm/K) exhibit CTE values closer to silicon (2.6 ppm/K).

This matching advantage effectively reduces the accumulation of thermal-mechanical stress caused by temperature changes. This characteristic is particularly crucial in applications requiring repeated thermal cycling, such as automotive and industrial equipment.

Manufacturing Complexity Comparison of Different Ceramic PCB Materials

●Aluminium oxide (Al₂O₃): The manufacturing process for aluminium oxide PCBs is well established, typically involving methods such as tape casting and metallisation paste screen printing, followed by sintering at around 1600°C. Its flexural strength ranges from 300 to 400 MPa, providing the rigidity required for standard assembly. These advantages also contribute to its competitive cost.

●Aluminium nitride (AlN): The manufacturing process requires strict control of the sintering atmosphere and temperature, typically between 1700 and 1900°C. Furthermore, due to the material’s sensitivity to moisture, metallisation processes must be compatible with its chemical composition. Despite its manufacturing complexities, aluminium nitride is widely used in applications such as high-power LED packaging, RF power amplifiers and automotive power electronics due to its relatively moderate cost.

●Silicon nitride (Si₃N₄): PCBs made from silicon nitride are usually produced using hot-press or gas-pressure sintering techniques. This material is strong, enabling thinner substrate designs that reduce thermal resistance. Tungsten or molybdenum-based systems are commonly used for metallisation on silicon nitride due to their tolerance of extreme thermal processing. Thanks to its exceptional reliability and thermal resistance, silicon nitride is used in automotive power electronics, industrial motor drives and the aerospace sector.

●Silicon Carbide (SiC): Although silicon carbide exhibits exceptional thermal conductivity and temperature stability, its electrical conductivity prevents it from being used as an insulating material on its own. It typically requires an additional insulating layer, such as silica or aluminum nitride, to provide electrical isolation.

●Beryllium Oxide (BeO): Beryllium oxide (BeO) represents the pinnacle of thermal conductivity among ceramic PCB materials, achieving thermal conductivities ranging from 250 to 300 W/m·K—far surpassing other materials. However, its toxicity severely limits its application, particularly due to the significant health risks posed by beryllium dust during manufacturing and handling processes.

Comparison of Multilayer Ceramic PCB Manufacturing Technologies (MLCC, LTCC, HTCC)

1.Multilayer Ceramic Capacitors (MLCC)

Dielectric Materials: Typically utilize ceramic materials such as barium titanate (BaTiO₃), titanium dioxide (TiO₂), and calcium zirconate (CaZrO₃).

Metal Materials: Internal electrodes commonly use nickel (Ni), copper (Cu), silver (Ag), or palladium-silver (Pd/Ag); terminal electrodes are typically copper or silver.

Sintering Temperature: Approximately 1100°C to 1350°C.

Application Fields: Consumer electronics, automotive electronics, communication equipment, and various other sectors.

2.Low-Temperature Co-fired Ceramics (LTCC)

Dielectric Materials: Commonly glass ceramics, ceramic-glass composites, and glass-bonded ceramics.

Metal Materials: Low-melting-point metals such as silver (Ag), gold (Au), copper (Cu), and palladium-silver (Pd/Ag).

Sintering Temperature: Generally between 800°C and 950°C.

Application Areas: High-frequency circuits, RF modules, microwave circuits, etc.

3.High-Temperature Co-fired Ceramics (HTCC)

Substrate Materials: Typically high-temperature ceramic materials such as alumina (Al₂O₃), aluminum nitride (AlN), and zirconia (ZrO₂) are selected.

Metal Materials: High-melting-point metals like tungsten (W), molybdenum (Mo), and manganese (Mn) are commonly used.

Sintering Temperature: Sintering occurs at elevated temperatures, typically between 1600°C and 1800°C.

Application Areas: High-temperature, high-frequency applications such as power electronics, sensors, and aerospace electronic devices.

The production processes for MLCC, LTCC, and HTCC share many similarities, typically involving steps such as green tape casting, screen printing, stacking, lamination, cutting, and firing. However, they differ in certain details.

For instance, MLCC processes do not require drilling holes, allowing direct printing of internal electrode paste, whereas LTCC and HTCC require drilling according to design specifications. Additionally, due to differing materials used, the sintering process involves distinct temperatures and atmospheres. MLCC sintering occurs at lower temperatures, while LTCC and HTCC sintering processes demand higher temperatures.

How to Select a Ceramic PCB Manufacturer ?

Choosing the right ceramic PCB supplier ensures product quality, delivery timelines, and cost control. Here are key evaluation criteria:

1. Technical Capabilities and Process Precision

Ceramic PCB manufacturing demands high-precision process capabilities. Suppliers should possess production capacity for complex processes such as multilayer boards, HDI (High-Density Interconnect), and high-frequency pcbs. Below are FastlinkPCB’s ceramic PCB manufacturing capabilities.

Specifications	Capabilities
Ceramic Substrates	Al₂O₃ (alumina), SiC, BeO, AlN (aluminum nitride), Si₃N₄ (silicon nitride)
Layers	1-4 Layer
Thicker Copper	1/3OZ-12OZ
Solder Mask	Yellow, White, Blue, Black. Green, Red
Thermal Conductivity	1-5W/K.M
Finished Surface	Immersion Silver, Immersion Gold, Nickel Palladium Gold
Finished Board Thickness	0.4MM-5MM
Copper Thickness	2μm to 105μm (DPC)
	150μm to 300μm (DBC)
Trace width/space	5-10μm: 0.05mm/0.05mm
	HOZ: 0.075mm/0.075mm
	1OZ: 0.1mm/0.1mm
	2OZ: 0.127mm/0.127mm
	3OZ: 0.3mm/0.3mm
	6OZ: 0.5mm/0.5mm
	9OZ: 0.6mm/0.6mm
Laser drill	≥60μm
Specifications	Capabilities
Ceramic Substrates	Al₂O₃ (alumina), SiC, BeO, AlN (aluminum nitride), Si₃N₄ (silicon nitride)
Layers	1-4 Layer
Thicker Copper	1/3OZ-12OZ
Solder Mask	Yellow, White, Blue, Black. Green, Red
Thermal Conductivity	1-5W/K.M
Finished Surface	Immersion Silver, Immersion Gold, Nickel Palladium Gold
Finished Board Thickness	0.4MM-5MM

2. Quality System and Certifications

Suppliers must maintain a comprehensive quality management system and hold international certifications such as ISO 9001 and IATF 16949 to ensure consistent and reliable product quality.

FastlinkPCB has obtained the following certifications:

• IATF 16949:2016
• ISO 9001:2015
• ISO 14001:2015
• ISO 13485:2016
• UL

3. Delivery Efficiency

Suppliers must possess rapid prototyping and mass production capabilities while flexibly handling urgent orders. FastlinkPCB offers 24-hour express prototyping and 48-hour small-batch delivery services to meet customers’ urgent needs.

4. Service and Cost Structure

Suppliers should offer competitive pricing and excellent customer service, including technical support and after-sales service. FastlinkPCB maintains a 24/7 technical support team to promptly resolve design and production challenges.

5. Industry Compatibility and Experience

Different application fields impose distinct requirements on PCBs. Ceramic PCBs are commonly used in high-power, high-frequency, and automotive electronics sectors. FastlinkPCB possesses extensive experience in high-power electronics, automotive electronics, medical devices, and communication equipment, enabling us to provide customized ceramic PCB solutions tailored to the specific needs of various industries.